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Sheet A · Product board
Unit price
USD45.99
USD68.99

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Field rating
4.0

Verified studio score · Spec revision current

Fit · Size

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine the optical laser separation machine

SKU: 71209036118

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 2 - Sep 7

Description

the optical laser separation machine is not able to remove the glue on the broken place when it separates the back glass cover if the glass is very smashed

iBox DFU programming tool for iPhone iPad iOS devices

Lens: HD microscope lens

Energy: 60S/120S/180S≈600J/1200J/2000J

Compatible testing for Samsung/Huawei/Xiaomi/Millet/OPPO/VIVO/Liu Hai/Lg Sony Screens

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine the optical laser separation machineYCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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